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Semiconductor quartz material
High purity quartz glass
HighpurityquartzglassisobtainedbyCVDorPCVDmethod.Theproducthashighpurity,withnobubble,nostripe,nofluorescence.Besides,ithassuperiorphysicalperformance.Thestressisupto2nm/cm.IthasdifferentOHcontentaccordingtothedifferentproductionprocesstomeetcustomerneeds.  Impurities&OHImpuritycontent  ppmproductAIFeCaMgTiCuMnNiCoBKNaLiOHHP3001B-1<0.12<0.05<016<0.02<0.03<0.01<0.01<0.01<0.01—<0.04<0.09<0.01~1100HP3001B-22.110.920.940.110.430.070.1———0.950.580.41≤5
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Flame fusion quartz glass
Atransparentquartzroundingotisproducedusingtheflamefusionmethod.Itcanbeprocessedintotransparentquartzdisc,squareplate,flange,etc.,forwindowsandsemiconductorquartzaccessories.Byre-hotshaping,wecanobtainclearquartzingotandquartzplate.Bypullingprocesstomaketransparentquartztubeandquartzrod,theproductisusedforsemiconductoraccessorymaterials,opticalguidefibermanufacturingaccessories. Impurities(ppm)productAlFeCaMgTiCuMnNiCoBKNaLiOHHP3002B-117.430.860.590.051.100.150.020.030.04—0.380.742.30~200HP3002B-212.140.200.400.051.200.020.42——0.100.600.800.40~200 PhysicalandmechanicalpropertiesPropertyHP3002BDensity2.21x103kg/m3Hardness580KHN100TensileStrength4.9x107Pa(N/m2)CompressionStrength1.1x109PaCoefficientofThermalExpansion5.5x10-7/℃ThermalConductivity1.4w/m℃SpecificHeat680J/kg℃Softeningpoint1700℃Annealingpoint1210℃
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Low OH quartz glass
LowOHquartzglassismadebyPlasmaFlameprocess,whichcanproduceroundingotandbereprocessedintoquartzplate,quartzflange,quartztube,quartzrod,etc.TheadvantageisthelowOHcontent(≤8ppm),whichiswidelyusedinsemiconductoraccessorymaterials.  Impurities(ppm)productAlFeCaMgTiCuMnNiCoBKNaLiOHHP3003-SS-B2.110.920.940.110.430.070.1———0.950.580.41≤8HP3003-AS-B12.140.200.400.051.200.020.42——0.100.600.800.40≤8HP3003-HK-B17.430.860.590.051.100.150.020.030.04—0.380.742.30≤8
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High purity opaque quartz glass
Opaquequartztubematerialwithspecialwallthicknessisproducedusingrotationtechnology.Itcanbeusedasbakingfurnacepipeandheatinsulationmaterialorusingflamefusionmethodtoproduceopaquequartzglass,thenbeprocessedintoquartzplate.Ithasgoodheatinsulationandtemperatureresistanceproperty.Itismainlyusedinheatinsulationpartsinsemiconductorprocessing. Impurities(ppm)productAlFeCaMgCuKNaLiHPR3004A25.000.50.80.10.11.62.20.3HPR3004B45.01.01.50.750.152.55.01.5 Transmission(T4mm)wavelength400nm500nm600nm700nmHPR30041.0%1.2%1.2%1.2% PhysicalandmechanicalpropertiesPropertyHPR3004Density1.95x103kg/m3CompressionStrength1.0x109Pa(N/m2)CoefficientofThermalExpansion5.4x10-7/℃ThermalConductivity1.24W/℃•mSpecificHeat650J/kg℃Softeningpoint1600℃Annealingpoint1100℃
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Semiconductor devices
Quartzplates,quartzflangeandquartztubearereshapedbyhydrogen-oxygenflameheatmethodaccordingtothecustomerneeds.Theyaremadeintotransparentopaqueandheterogeneousquartzglassproducts,includingquartzboat,diffusiontube,semiconductorcleaningtank,quartzappliances,etc.Theyarewidelyusedinsemiconductor,photovoltaic,opticalfiberaccessoriesmaterials.
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